This study introduces a new class of thermal interface materials （TIMs）known as metallic phase change TIMs， which exhibit a solid-to-liquid phase transformation below 100°C.These materials remain solid at room temperature， making them advantageous for the manufacturing and assembly of electronic chips.As operating temperatures of electronic devices are typically maintained below 100°C，the metallic phase change TIMs transition to a paste-like state，effectively filling micro-gaps induced by surface roughness and coefficient of thermal expansion mismatches between components.This transition enhances thermal contact and promotes efficient heat dissipation during device operation.The paper details the thermal properties，phase behavior，and effective thermal conductivity of this class of TIMs，demonstrating their superior performance compared to conventional polymer-based TIMs